Texas Instruments attended the 2016 China Automotive Engineering Society Annual Conference and Exhibition to showcase innovative automotive electronics at close range

On November 4th, 2016, Shanghai Instruments Texas Instruments (TI) attended the China Automotive Engineering Society Annual Conference and Exhibition (SAECCE) held in Shanghai from October 26th to 28th, 2016. A variety of innovative automotive electronics applications for the "Jacinto 6" series infotainment system processor (DRA7xx) and the TDAx driver-assisted system-on-a-chip (SoC) processor. SAECCE is an annual event for the automotive industry organized by the China Automotive Engineering Society (SAE-China). It attracts many technical leaders from domestic and foreign well-known vehicle and component companies, experts and scholars from research institutes, leaders of government and industry organizations, and R & D Engineer. TI's innovative products and technologies demonstrated during SAECCE not only strengthen its leadership in the automotive industry, but also further demonstrate TI's commitment to achieve greater through a broad portfolio of automotive products, continuous innovation, system expertise and technical support. A commitment to safety, a greener and a more entertaining driving experience.

In this exhibition, TI brings advanced advanced driver assistance systems and infotainment solutions for entry-level to medium- and high-end models, including virtual dashboards, 2D/3D panoramic viewing, driver monitoring and identification, Car night market support system and rearview mirror electronic camera display. TI's "Jacinto 6" series of infotainment processor delivers an unprecedented range of in-vehicle infotainment systems, instrument clusters and telematics capabilities for next-generation vehicles with powerful software and ecosystem products. TI's TDAx Driver-Assisted SoC Series provides scalable open solutions and common hardware and software architecture for advanced driver assistance system (ADAS) applications such as camera-based front view (mono and stereo), Rear view, surround and night vision systems, and mid-range radar and sensor fusion systems.

Virtual dashboards, entertainment navigation and 3D look-around applications based on TI's Jacinto 6 series processors

The virtual dashboard based on the TI Jacinto 6 series processor features the TI DRA74x ("Jacinto 6") infotainment processor, which provides a rich hardware interface and a large number of peripherals. Based on the OMAP 5 architecture, the DRA74x "Jacinto 6" includes two ARM® CortexTM-A15 cores, four Cortex-M4 cores and two SGX544 3D graphics cores for superior performance and driving experience. The TI's digitalized cockpit system based on TI's Jacinto 6 EP demonstrates the versatility of a versatile digital cockpit with two C66x DSPs. Thanks to its unique multi-core heterogeneous architecture, the solution can support multiple cameras and easily implement 3D. Panoramic viewing and in-house driver monitoring, as well as smooth operation of the infotainment system through the main core, including multimedia navigation, analog and digital radio, CarPlay and mobile phone interconnection.

Virtual dashboard based on TI Jacinto 6 series processor

Front view of the TDA2/3x series for the EuroNCAP 2018

With the advent of the Advanced Driver Assistance System (ADAS) system and the drive and development of driverless driving, cars need to be well versed in the surrounding environment. Cars rely on a variety of sensors to sense the complex surroundings in different situations. This data is then transmitted to high-precision processors such as the TDA2x and finally used for automatic emergency braking (AEB), lane departure warning (LDW) and blind spot monitoring. The TDA2/3x-based forward-looking solution enables the use of DSPs to identify and monitor traffic signs, traffic lights, vehicles, pedestrians, and roads while fully meeting the EuroNCAP 2018 road safety standards. In addition, with additional EVE and DSP, the solution provides another set of binocular stereoscopic camera systems that utilize the principle of binocular imaging for precise ranging and depth information, further enhancing the safety of the car.

Front view of the TDA2/3x series for the EuroNCAP 2018

As a leader in the semiconductor industry, TI has a broad portfolio of more than 100,000 and is continuing to innovate at a rate of 900 new products per year, including more than 130 automotive products. At present, TI ADAS SoC has shipped more than 15 million units, further confirming TI's leading position in the automotive market. At the same time, TI's open and flexible solutions have been applied in the production process of more than 25 original equipment manufacturers, with more than 100 models, designed to help reduce the number of traffic accidents and achieve more automatic driving experience.

Texas Instruments drives innovation in the automotive sector

TI's state-of-the-art semiconductor products enable manufacturers and system suppliers to deliver world-class product features to the automotive market. Our broad portfolio of automotive products includes analog power management, interface and signal chain solutions as well as DLP® displays, ADAS and infotainment processors, HerculesTM TMS570 secure microcontrollers and wireless connectivity solutions. In addition, TI offers components designed to help original equipment manufacturers (OEMs) produce SafeTITM components that meet ISO 26262 requirements and components that are specifically specified to comply with AEC-Q100 and TS16949 standards, all with excellent product documentation. Visit TI's automotive page or TI's E2ETM Behind the Wheel blog to learn more about our commitment to innovation in the automotive arena.