ホーム > ブログ> ON Semiconductor Introduces Automotive Power Integrated Module Solution for Next Generation Automotive Brushless DC Systems

ON Semiconductor Introduces Automotive Power Integrated Module Solution for Next Generation Automotive Brushless DC Systems

November 23, 2022

ON Semiconductor has further expanded its lineup of automotive power integration modules (PIMs) to introduce the STK984-190-E. The module is optimized to drive three-phase brushless DC motors (BLDC) for modern automotive applications, including six 40 V, 30 A MOSFETs configured as a three-phase bridge and an additional 40 V, 30 A high-side reversal Battery protection MOSFET. These MOSFETs are mounted on a direct-bond copper (DBC) substrate to create a compact module with excellent heat dissipation that occupies only half the board space used in a discrete solution with equal performance.

The module is suitable for 12 V automotive motor drive applications with rated power up to 300 W, such as electric pumps, fans and windshield wipers. Designers use a combination of motor controllers such as the LV8907UW to create an energy-efficient BLDC solution with best-in-class thermal performance and built-in diagnostics, and an ultra-small PCB that saves critical size and weight.

Using this module can significantly reduce component count and bill of material costs. The DBC substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFET. This reduces power loss and enhances reliability by reducing temperature variations during thermal cycling. The insulation provided by the DBC substrate also increases reliability. The STK984-190-E specifies an operating temperature range of -40 ° C to 150 ° C. All integrated MOSFETs are AEC-Q101 certified.

Chris Chey, general manager of System Solutions at ON Semiconductor, said: "The development of an efficient BLDC drive solution typically requires at least 13 to 15 discrete components, while the STK984-190-E automotive power module requires less than half the components. In addition to compact Dimensions, STK984-190-E's rugged thermal performance supports the use of smaller heat sinks, which significantly reduces the size and weight of the system, which means that engineers can now fully meet the challenges of improving fuel economy and overcoming space constraints. ”

お問い合わせ

Author:

Mr. Liu Keda

Eメール:

syzdhx@163.com

Phone/WhatsApp:

+8613904003748

人気商品
You may also like
Related Categories

この仕入先にメール

タイトル:
イーメール:
メッセージ:

Your message must be betwwen 20-8000 characters

お問い合わせ

Author:

Mr. Liu Keda

Eメール:

syzdhx@163.com

Phone/WhatsApp:

+8613904003748

人気商品

Copyright ©2024 Shenyang Zhongda Huanxin Refrigeration Technology Co., Ltd.著作権を有します

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

送信